Avicena to demonstrate connectorized LightBundle microLED optical interconnect at ECOC 2026

LightBundle is designed to support optical connectivity across both scale-in and scale-up architectures, including:

• Die-to-die and die-to-memory connectivity within or between packages
• XPU-to-XPU and XPU-to-CPU interconnects
• XPU-to-memory and memory-disaggregation architectures
• XPU-to-switch and NIC-to-switch connectivity
• Board-to-board, tray-to-tray, and rack-to-rack links

Designed for AI Scale-In and Scale-Up

The platform’s integrated microLED and photodetector arrays are designed for low-power operation, high bandwidth density, robust performance at elevated temperatures, and flexible reach beyond the practical limits of high-speed copper.

Unlike laser-based architectures, LightBundle does not require external lasers, wavelength stabilization, optical modulators, or complex wavelength-division multiplexing.

The architecture is also designed to integrate with a broad range of semiconductor processes and packaging approaches, allowing optical connectivity to be placed closer to compute, memory, and switching silicon.

“Adopting a new interconnect technology requires customers to understand how it will be manufactured, assembled, and serviced in their systems,” said Ben Bajarin, CEO and Principal Analyst at Creative Strategies

. “Avicena’s work on a connectorized interface addresses an important part of that challenge and is a necessary step toward making microLED interconnect technology practical for AI infrastructure, where customers have different requirements for bandwidth, power, and system design.”

Live Demonstration at ECOC 2026

At ECOC 2026, Avicena will demonstrate a live inline connectorized LightBundle eKit link operating between microLED transmitter and integrated photodetector arrays.

The demonstration will highlight:

• Detachment and reconnection of the optical interface
• Real-time data transmission across the connectorized link
• High-density parallel connectivity through multicore fiber
• Link performance and bit-error-rate monitoring
• Compact fiber routing for space-constrained AI systems
• Reliable operation without lasers or optical modulators

Attendees can see the demonstration and meet the Avicena team at Stand 1365 during ECOC Exhibition 2026, September 21–23, at FYCMA in Málaga, Spain.

Availability

Avicena is engaging with hyperscalers, AI accelerator companies, memory manufacturers, networking companies, system OEMs, and packaging partners to evaluate LightBundle implementations for future AI infrastructure.

Organizations interested in evaluating the technology or discussing system integration can contact Avicena at nigel@avicena.tech