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One Part Epoxy Adhesive Has Ultra Low Thermal Resistance
Master Bond Supreme 18TC is a single component smooth paste epoxy adhesive. Formulated with a blend of special thermally conductive fillers, this system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal…
Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, at both high and low temperatures. It bonds well to a wide variety of substrates including metals, composites, ceramics and plastics. It has a high strength profile consisting of tensile lap shear strength of 2,200-2,400 psi, tensile strength 6,000-7,000 psi, t-peel strength of 5-10 pli and a compressive strength of 22,000-24,000 psi.
As a one part system, it requires no mixing. Its working life is essentially unlimited. To obtain optimal performance properties, heat cure for 60-90 minutes at 250-300°F followed by a post cure of a few hours at 350°F. Supreme 18TC features low shrinkage, a low CTE and a high degree of dimensional stability. This system is also a reliable electrical insulator.
Supreme 18TC is designed to withstand thermal cycling and shock. It is serviceable over the wide temperature range of 4K to +400°F. This formulation is available for use in a variety of standard packaging options in sizes ranging from ounces to gallons.
For additional information, please visit https://www.masterbond.com/tds/supreme-18tc
