Call for Papers: ITherm 2016

ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016, www.ectc.net), a premier electronic packaging conference, at the Cosmopolitan Hotel in Las Vegas, Nevada, USA. Based on the success of ITherm 2014 in Orlando, Florida, USA, papers will be presented in oral and selected topical poster sessions. All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings. In addition to paper presentations and vendor exhibits, ITherm 2016 will include panel discussions, keynote lectures by prominent speakers, and professional short courses. Original papers are solicited in the following general areas (but not limited to):

Thermal Management:

• Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface Materials

• Natural and Forced Convection Air Cooling

• Advances in Compact Air Movers

• Single-Phase Liquid Cooling

• Novel Phase Change Cooling Techniques: Boiling, Thin Film Evaporation, Heat Pipes, Thermosyphon, Spray and Jet Impingement

• Microfabricated Thermal Management Devices and Systems

• Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption, Adsorption, Thermo-acoustic, Magnetocaloric

• Thermal Management in Wireless, Networking, Computing, Lighting, Harsh Environments, and Peripheral Hardware.

• Thermal and Energy Management in Data Centers

• Three-Dimensional Electronics

• Advances in Experimental Characterization

• Advances in Computational Characterization: Multi-Scale Modeling, Compact Modeling, Multi-Physics Modeling, Multi-Objective Design and Optimization

Mechanics:

• Modeling and Simulation for Reliability at Package, Board, and System Levels

• Failure Mechanics and Damage Modeling

• Experimental Techniques

• Constitutive Models

• Impact, Drop and Vibrational Analysis of Packages,

Sub-Systems, and Systems

• Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects

• Materials Characterization, Simulation, Design

Emerging Technologies:

• Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)

• Nanotechnology: Thermal, Mechanics, Material and Process Related Issues in Nanostructures

• Micro-Fluidics

• Chip-Integrated/Embedded Cooling Systems

• Fiber-Optics Interconnect Systems & Free Space

Optical Interconnects

• MEMS: Device and Package Level Reliability Issues

• Integrated Biochips and Bioelectronics

• Medical, Telecommunication, and Automotive Systems

• Space Systems: Earth Orbiting and Deep-Space Missions

Submit an Abstract
Please submit a 400 word text-only (no figures and tables) abstract on the ITherm website: www.ieee-itherm.org. Deadline for Abstracts is September 4th, 2015. Notifications of acceptance will be sent out by October 2nd, 2015.